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| Plastic Packages for Integrated Circuits Single-In-Line Plastic Packages (SIP) -AE L2 A 0.006 -B- (0.15) C2 Z5.067A 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT "GULLWING" LEAD FORM INCHES SYMBOL MIN 0.170 0.048 0.350 0.395 0.310 0.310 0.549 0.068 0.045 MAX 0.180 0.055 0.370 0.405 0.569 0.088 0.055 MILLIMETERS MIN 4.32 1.22 8.89 10.04 7.88 7.88 13.95 1.72 1.15 MAX 4.57 1.39 9.39 10.28 14.45 2.24 1.40 NOTES 5 4 5, 6, 7 5 Rev. 3 4/03 NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-169AB, Issue A. 2. Controlling dimension: Inch. 3. Dimensioning and tolerance per ANSI Y14.5M-1982. 4. Gauge plane L3 is parallel to heatslug plane. 5. Dimensions include lead finish. 6. Leads are not allowed above the datum -B- . 7. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum "b" by more than 0.003'' (0.08mm). D -CL HEATSLUG PLANE 0.00 - 0.0098 (0.00 - 0.25) L1 A C2 D E D1 PIN #1 c e b 0.010 (0.25) M B A M CM L3 0.450 (11.43) MIN 0.004 (0.10) 0 -8 o o E1 L L1 L2 L3 0.030 BSC 0.028 0.018 0.037 0.024 0.76 BSC 0.71 0.46 0.94 0.60 E1 b c e 0.067 BSC 1.70 BSC D1 0.609 (15.46) MIN BACK VIEW 0.350 (8.89) MIN 0.129 (3.27) TYP 0.043 (1.09) TYP e LAND PATTERN 1 |
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